September 13, 2016

Hypres awarded potential $40 million IDIQ contract to develop cryogenic RF systems for the U.S. Navy

Elmsford, NY (September 13, 2016)—Hypres, The Digital Superconductor Company™, has been awarded a potential $40,387,367 Indefinite-Delivery/Indefinite-Quantity (IDIQ) contract by the U.S. Navy to research, develop, evaluate […]
May 9, 2016

HYPRES’ role in IARPA C3 program referenced in IEEE Spectrum

HYPRES’ role in IARPA’s Cryogenic Computing Complexity (C3) program was referenced in IEEE Spectrum article titled “Will the NSA Finally Build Its Superconducting Spy Computer? The […]
January 12, 2016

UMD Physicists, Teamed with HYPRES, Develop New Material that becomes Invisible to Microwave Radiation with Flip of a Switch

University of Maryland physicists, teamed with HYPRES, have developed a new cloaking material that can become transparent to microwave radiation with the flip of a switch. […]
August 5, 2015

HYPRES Increases Speed of World’s Fastest Commercially-Available Superconductor Integrated Circuits

Company unveils a new commercial fabrication process for superconducting ICs with an increased critical current density of 10 kA/cm2—addressing the need to increase speed in high-end […]
July 30, 2015

HYPRES to Develop Cryogenic Memory Solution for IARPA Superconducting Computers Program

HYPRES, the Digital Superconductor Company, announced that it is working to develop energy-efficient, high-density, cryogenic magnetic random access memory (MRAM) as part of a team led […]
January 19, 2015

IARPA Launches Program to Develop a Superconducting Computer

Director of National Intelligence (ODNI), recently announced that it has embarked on a multi-year research effort to develop a superconducting computer. Technology developed under the Cryogenic […]
November 18, 2013

JJ and Digital Superconductor Technology Featured in EE Journal Article; Superconductor Week Also Provides Coverage

Based on the news of its recently upgraded commercial superconducting circuit fab from four layers to six, HYPRES was featured in articles in EE Journal and […]
August 9, 2013

HYPRES’ New Chip Fab Process Featured as “Cover Story” in Microwaves & RF Magazine

With its cover prominently displaying the headline “Superconductors Speed to Higher Levels of Integration,” Microwaves & RF magazine is featuring HYPRES and its new commercially available […]