HYPRES’ New Chip Fab Process Featured as “Cover Story” in Microwaves & RF Magazine

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With its cover prominently displaying the headline “Superconductors Speed to Higher Levels of Integration,” Microwaves & RF magazine is featuring HYPRES and its new commercially available chip fab process in the August issue. (Read the PDF version of the article here HYPRES_cover story_MW&RF_Aug 2013)
Technical contributor Jack Browne recently visited with the HYPRES team and toured the facility and digital superconductor foundry.   The article describes the new six-layer fab process and provides plenty of technical details. It all also highlights the benefits to customers, ordering information and other HYPRES achievements in its development of digital superconductor ICs, including its Analog-to-Digital Converters and its Arithmetic Logic Unit.