Cryopackaging

J. Delmas, A.M. Kadin, R.J. Webber, and E.K. Track, “Figures of Merit for Multi-Stage Cryocoolers,” Advances in Cryogenic Engineering Conference-CEC, Vol.55, pp 149-156, 2010.

Vladimir V. Dotsenko, Jean Delmas, Robert J. Webber, Timur V. Filippov, Dmitry E. Kirichenko, Saad Sarwana, Deepnarayan Gupta, Alan M. Kadin, and Elie K. Track, “Integration of a 4-Stage 4 K Pulse Tube Cryocooler Prototype With a Superconducting Integrated Circuit, ” IEEE Trans. on Applied Superconductivity, vol. 19, no. 3, pp. 1003-1007, June 2009.

Robert J. Webber, Jean Delmas, and Brian H. Moeckly, “Ultra-Low Heat Leak YBCO Superconducting Leads for Cryoelectronic Applications, ” IEEE Trans. on Applied Superconductivity, vol. 19, no. 3, pp. 999-1002, June 2009.

Robert J. Webber, Charles J. Burroughs, and Masoud Radparvar, “Performance of a Cryocooled Nb DC Programmable Voltage Standard at 4 K,” IEEE Trans. on Applied Superconductivity, vol. 17, no. 4, pp. 3857-3861, December 2007

Alan M. Kadin, Robert  J. Webber, and Deepnarayan Gupta, “Current Leads and Optimized Thermal Packaging for Superconducting Systems on Multistage Cryocoolers,” IEEE Trans. on Applied Superconductivity, vol. 17, no. 2, pp. 975-978, June 2007

Steven B. Kaplan, Vladimir Dotsenko, and Diana Tolpygo, “High-Speed Experimental Results for an Adhesive-Bonded Superconducting Multi-Chip Module, ” IEEE Trans. on Applied Superconductivity, vol. 17, no. 2, pp. 971-974, June 2007

Alan M. Kadin, Robert  J. Webber, and Saad Sarwana, “Effects of Superconducting Return Currents on RSFQ Circuit Performance,” IEEE Trans. on Applied Superconductivity, vol. 15, no. 2, pp. 280-283, June 2007.

Deepnarayan Gupta, Alan M. Kadin, Robert J. Webber, Irwin Rochwarger, Daniel Bryce, William J. Hollander, Young Uk Yim, Channakeshav, Russell P. Kraft, Jin-Woo Kim, and John. F. McDonald, “Integration of Cryocooled Superconducting Analog-to-Digital Converter and SiGe Output Amplifier,” IEEE Trans. on Applied Superconductivity, vol. 13, no. 2, pp. 477-483, June 2003.

D. Gupta, W. Li, S. B. Kaplan, and Igor V. Vernik, “High-Speed Interchip Data Transmission Technology for Superconducting Multi-Chip Modules,” IEEE Trans. Appl. Supercond. 11, 731-734 2001.

Dmitri Gaidarenko and Ray Robertazzi, “High Performance Packaging System for Superconducting Electronics,” IEEE Trans. on Applied Superconductivity, vol. 9, no. 2, pp. 3668-3671, June 1999.

OIeg  A. Mukhanov, Sergey V. Rylov, Dmitri V. Gaidarenko, Noshir B. Dubash and Valery V. Borzenets, “Josephson Output Interfaces for RSPQ Circuits,” IEEE Trans. on Applied Superconductivity, vol. 7, no. 2, pp. 2826-2831, June 1997.

Raphael P. Robertazzi, Irfan Siddiqi, and 0. Mukhanov, “Flux Trapping Experiments in Single Flux Quantum Shift Registers,” IEEE Trans. on Applied Superconductivity, vol. 7, no. 2, pp. 3164-3167, June 1997.