Press Releases

December 5, 2017
2017 MRS FALL MEETING banner image

HYPRES exhibits at MRS

2017 MRS Fall Meeting & Exhibit | November 26 – December 1 | Boston, Massachusetts HYPRES participated in the 2017 fall exhibit of the Material Research […]
October 15, 2017
MILCOM2017 banner image

HYPRES exhibits at MILCOM 2017

MILCOM2017 – October 23-25 in Baltimore, Maryland HYPRES was one again pleased to exhibit at MILCOM 2017 in Baltimore on Oct. 23-25. MILCOM, in its 36th […]
April 27, 2017
Dr. Gupta at Hypres tradeshow booth

Active conference schedule for HYPRES, latest stop GOMACTech

Fresh off its participation at APS Physics in New Orleans, HYPRES continued its busy 2017 conference schedule by participating at GOMACTech in Reno. Deep Gupta, PhD […]
September 13, 2016

Hypres awarded potential $40 million IDIQ contract to develop cryogenic RF systems for the U.S. Navy

Elmsford, NY (September 13, 2016)—Hypres, The Digital Superconductor Company™, has been awarded a potential $40,387,367 Indefinite-Delivery/Indefinite-Quantity (IDIQ) contract by the U.S. Navy to research, develop, evaluate […]
January 12, 2016

UMD Physicists, Teamed with HYPRES, Develop New Material that becomes Invisible to Microwave Radiation with Flip of a Switch

University of Maryland physicists, teamed with HYPRES, have developed a new cloaking material that can become transparent to microwave radiation with the flip of a switch. […]
August 5, 2015

HYPRES Increases Speed of World’s Fastest Commercially-Available Superconductor Integrated Circuits

Company unveils a new commercial fabrication process for superconducting ICs with an increased critical current density of 10 kA/cm2—addressing the need to increase speed in high-end […]
July 30, 2015

HYPRES to Develop Cryogenic Memory Solution for IARPA Superconducting Computers Program

HYPRES, the Digital Superconductor Company, announced that it is working to develop energy-efficient, high-density, cryogenic magnetic random access memory (MRAM) as part of a team led […]
July 5, 2013

HYPRES Announces Commercial Availability of New Chip Fabrication Process for Next Generation Superconducting Electronics Circuits

—New six-layer planarized process increases the integration level of superconducting ICs and critical current density of Josephson junctions in high-end computing, advanced wireless communications and instrumentation— […]